ADVERTISEMENT
 
 

Thermally Conductive Products

Available from Master Bond, Inc.

Thermally Conductive Products
The recent trend in electronic packaging is for greater functionality in decreasing sizes of circuitry. This phenomenon has caused an urgent need for enhanced heat dissipation and heat sinking...Read More

Product Description
The recent trend in electronic packaging is for greater functionality in decreasing sizes of circuitry. This phenomenon has caused an urgent need for enhanced heat dissipation and heat sinking without loss of desirable electrical insulation characteristics. Master Bond Inc. offers a wide range of thermally conductive, electrically insulative systems which offer effective solutions to demanding heat dissipation problems.

More Products from Master Bond, Inc.

Available from: Master Bond, Inc.
Master Bond Inc. manufactures an extensive line of adhesives, sealants, conformal coatings, potting & encapsulation compounds and other specialty systems designed to meet the diverse needs of the...Read More
Available from: Master Bond, Inc.
Master Bond Inc. offers a broad line of potting and encapsulation materials designed to protect electronic circuitry and assemblies from potentially damaging conditions such as moisture, various...Read More
Available from: Master Bond, Inc.
Master Bond Inc. offers a broad line of electrically conductive adhesives, sealants and coatings which are widely used in the electronic and electrical industries. They are formulated with metal...Read More
Available from: Master Bond, Inc.
Conformal coatings are essential materials for enhancing the long term reliability and performance of electronic assemblies, particularly when exposed to harsh conditions such as high humidity,...Read More
Available from: Master Bond, Inc.
Master Bond Inc. offers a wide range of versatile, high performance epoxy formulations designed to withstand the severe conditions found in cryogenic environments. They are available as one or two...Read More

Related Research You May Be Interested In

Designing Ultra Low Noise Amplifiers for Infrastructure Receiver Applications
The construction of low noise amplifiers (LNAs) is a complex process that requires the utilization of both pHEMT technology, and cascode topology. By harnessing these two...Read More
By: Skyworks | Published: 11/9/2010View all white papers by Skyworks
Choosing the Right RF Switches for Smart Mobile Device Applications
Modern smart phones and tablet computers typically incorporate multiple wireless services at different frequency bands ranging from FM radio to LTE. At the same time, an...Read More
By: Skyworks | Published: 11/4/2011View all white papers by Skyworks
ADVERTISEMENT